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<?xml-stylesheet type="text/xsl" href="http://engineeringtv.com/utility/FeedStylesheets/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Engineering TV : Test</title><link>http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx</link><description>Tags: Test</description><dc:language>en</dc:language><generator>CommunityServer 2007.1 (Debug Build: 20917.1142)</generator><item><title>LeXsolar Solar Energy Experiment Kit</title><link>http://engineeringtv.com/blogs/etv/archive/2009/11/12/lexsolar-solar-energy-experiment-kit.aspx</link><pubDate>Thu, 12 Nov 2009 13:27:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:31600</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>2</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=31600</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/11/12/lexsolar-solar-energy-experiment-kit.aspx#comments</comments><description>Numerous experiments dealing with solar electric systems and optics make the LeXsolar solar energy experiment kit a unique tool for students to learn about photovoltaic technology.  The kit consists of a main board and a variety of modules.  These modules can be plugged on the main board to make electrical circuits and measurements.  The innovative structure of the main board, the modules and explanation book and CD make the system very versatile and extendable.  For more information, visit &lt;a href="http://www.solarc.de" target="_blank"&gt;SOLARC&lt;/a&gt;.
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&lt;p&gt;&lt;p align="center" id="video_31600"&gt;&lt;br /&gt;(785 Views, 2 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=31600" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/31600.ashx" length="10958" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/11/091112a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/11/091112b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Consumer/default.aspx">Consumer</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Green/default.aspx">Green</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Education/default.aspx">Education</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Solar/default.aspx">Solar</category></item><item><title>SPECK.CHECK For First Article Inspection</title><link>http://engineeringtv.com/blogs/etv/archive/2009/10/20/speck-check-for-first-article-inspection.aspx</link><pubDate>Tue, 20 Oct 2009 13:44:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:31556</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=31556</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/10/20/speck-check-for-first-article-inspection.aspx#comments</comments><description>CGI&amp;#39;s Spec.Check inspection software, for use with any digitizing system, is designed for first article inspection or mold qualification and can save users time in performing dimension measurements - up to 75 percent, according to the developer.  In one instance, a company needed to measure an eight cavity mold with 93 dimensions per cavity -- normally an 80-hour task.  With Spec.Check, the job was completed in less than six hours.  For more information, visit &lt;a href="http://www.cgiinspection.com" target="_blank"&gt;CGI Inspection&lt;/a&gt;.
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&lt;p&gt;&lt;p align="center" id="video_31556"&gt;&lt;br /&gt;(475 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=31556" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/31556.ashx" length="9545" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/10/091020a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/10/091020b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Modeling/default.aspx">Modeling</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Fabrication/default.aspx">Fabrication</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/CAD/default.aspx">CAD</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Rapid+Prototyping/default.aspx">Rapid Prototyping</category></item><item><title>CGI Cross Sectional Scanning</title><link>http://engineeringtv.com/blogs/etv/archive/2009/10/19/cgi-cross-sectional-scanning.aspx</link><pubDate>Mon, 19 Oct 2009 12:04:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:31555</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=31555</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/10/19/cgi-cross-sectional-scanning.aspx#comments</comments><description>First article inspection is an essential and crucial step in product development and in proving a new mold.  But when the part geometry is complex – and especially when the internal geometry is complex – the measuring and qualifying process can take days, if not weeks.  This is unacceptable in terms “time to market” as well as in terms of “cost.”  The CGI System and Spec.Check solves these problems by providing complete measured results in one to two days instead of the weeks that others processes require.  For more information, visit &lt;a href="http://www.cgiinspection.com" target="_blank"&gt;CGI Inspection&lt;/a&gt;.
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&lt;p&gt;&lt;p align="center" id="video_31555"&gt;&lt;br /&gt;(504 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=31555" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/31555.ashx" length="9075" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/10/091019a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/10/091019b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Modeling/default.aspx">Modeling</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Fabrication/default.aspx">Fabrication</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/CAD/default.aspx">CAD</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Rapid+Prototyping/default.aspx">Rapid Prototyping</category></item><item><title>uPrint Personal 3D Printer</title><link>http://engineeringtv.com/blogs/etv/archive/2009/06/25/uprint-personal-3d-printer.aspx</link><pubDate>Thu, 25 Jun 2009 14:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:31294</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>1</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=31294</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/06/25/uprint-personal-3d-printer.aspx#comments</comments><description>As a personal 3D printer, uPrint makes 3D printing immediate and convenient through every design iteration.  Designed for the desktop, uPrint requires only a 25 x 26 in. footprint and features an 8 x 6 x 6 in. build envelope.  Using Dimension’s proven FDM technology, uPrint builds models with Stratasys ABSplus — a material on average 40 percent stronger than the company’s standard ABS material, making it ideally suited for testing the form, fit and function of models and prototypes.  uPrint also features a soluble support removal system, allowing for hands-free removal of the model support material.  For more information, go to: &lt;a href="http://uprint.dimensionprinting.com" target="_blank"&gt;Dimension uPrint&lt;/a&gt;.
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&lt;p align="center" id="video_31294"&gt;&lt;br /&gt;(3047 Views, 1 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=31294" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/31294.ashx" length="11941" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/06/090625a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/06/090625b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Industrial+Design/default.aspx">Industrial Design</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Modeling/default.aspx">Modeling</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Fabrication/default.aspx">Fabrication</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/CAD/default.aspx">CAD</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Rapid+Prototyping/default.aspx">Rapid Prototyping</category></item><item><title>Luminary Micro Tempest Microcontroller Kits</title><link>http://engineeringtv.com/blogs/etv/archive/2009/05/21/luminary-micro-tempest-microcontroller-kits.aspx</link><pubDate>Thu, 21 May 2009 14:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:31230</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=31230</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/05/21/luminary-micro-tempest-microcontroller-kits.aspx#comments</comments><description>Luminary Micro founder and CMO, Jean Anne Booth, highlights several new development and reference design kits based around their &amp;quot;Tempest&amp;quot; 4th generation microcontrollers.  Kits include: the Brushless DC (BLDC) Motor Reference Design Kit, Serial-to-Ethernet Reference Design Kit, and the Brushed DC (BDC) Motor Reference Design Kit.  As ARM&amp;#39;s lead partner for Cortex-M3 technology, Luminary Micro delivers the world&amp;#39;s first silicon implementation of the Cortex-M3 processor, providing 32-bit performance at 8-/16-bit cost.  For more information, go to: &lt;a href="http://www.luminarymicro.com" target="_blank"&gt;Luminary Micro&lt;/a&gt;.
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&lt;p align="center" id="video_31230"&gt;&lt;br /&gt;(1817 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=31230" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/31230.ashx" length="11611" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/05/090521a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/05/090521b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category></item><item><title>G2 Microsystems: Wi-Fi Made Simple</title><link>http://engineeringtv.com/blogs/etv/archive/2009/01/14/g2-microsystems-wi-fi-made-simple.aspx</link><pubDate>Wed, 14 Jan 2009 15:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30329</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>4</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30329</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/01/14/g2-microsystems-wi-fi-made-simple.aspx#comments</comments><description>One of only two technologies recognized in the Best Communications / Wireless category by Electronic Design magazine editors, and winner of the Best Wireless Chip designation, the G2C547 system-on-a-chip is G2 Microsystems’ first in its Epsilon family of Wi-Fi chips that make it easy for manufacturers to embed Wi-Fi connectivity into almost anything.  Jason Crawford, G2&amp;#39;s Director of Applications, discusses the benefits of the ultra low-power SoC (system-on-a-chip) as well as their new G2M5477 Wi-Fi module that helps developers easily create a final working product.  Also watch this episode: &lt;a href="http://engineeringtv.com/blogs/etv/archive/2009/01/15/g2-microsystems-embedded-wi-fi.aspx"&gt;G2 Microsystems: Embedded Wi-Fi&lt;/a&gt;.  For more information, go to: &lt;a href="http://www.g2microsystems.com" target="_blank"&gt;G2 Microsystems&lt;/a&gt;.
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&lt;p align="center" id="video_30329"&gt;&lt;br /&gt;(2194 Views, 4 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30329" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30329.ashx" length="11249" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/01/090114a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/01/090114b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/RF/default.aspx">RF</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category></item><item><title>THINERGY Application Development Platform</title><link>http://engineeringtv.com/blogs/etv/archive/2009/01/08/thinergy-application-development-platform.aspx</link><pubDate>Thu, 08 Jan 2009 15:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30318</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>1</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30318</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2009/01/08/thinergy-application-development-platform.aspx#comments</comments><description>THINERGY thin-film micro-energy cells deliver a highly efficient, safe, rechargeable and powerful energy storage solution in an extremely thin form factor—roughly the size of a postage stamp.  The newly released Application Development Platform (ADP) tool from Infinite Power Solutions provides a simple method to charge, discharge and monitor THINERGY MECs during device evaluation and system integration. The ADP’s built-in demo mode provides pre-defined loads (constant resistance, constant current, pulsed current and standard LED load) to discharge the battery while displaying the time, state of charge, and discharge voltage/current.  In addition, the ADP serves as a development platform to allow users to develop their own applications on a separate breadboard, and allows the user to connect various energy harvesting circuits to charge the battery—enabling the developer to easily prototype and emulate their entire microelectronic system.  Also watch this episode: &lt;a href="http://engineeringtv.com/blogs/etv/archive/2009/01/07/thinergy-micro-energy-cells.aspx"&gt;THINERGY Micro-Energy Cells&lt;/a&gt;.  For more information, go to: &lt;a href="http://www.infinitepowersolutions.com" target="_blank"&gt;Infinite Power Solutions&lt;/a&gt;.
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&lt;p align="center" id="video_30318"&gt;&lt;br /&gt;(1927 Views, 1 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30318" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30318.ashx" length="11295" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2009/01/090108a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2009/01/090108b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Simulation/default.aspx">Simulation</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Power/default.aspx">Power</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category></item><item><title>New Analog to Digital Converter Technology</title><link>http://engineeringtv.com/blogs/etv/archive/2008/11/17/new-analog-to-digital-converter-technology.aspx</link><pubDate>Mon, 17 Nov 2008 14:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30148</guid><dc:creator>Terry Knight</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30148</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/11/17/new-analog-to-digital-converter-technology.aspx#comments</comments><description>From the labs at Analog Devices comes a new technology in analog to digital converter technology that is the culmination of three years work. In this episode, Bill Scofield, Design Group Leader, explains the new continuous time sigma delta converter that uses an internal loop filter with no switch capacitor sampler section.
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&lt;p align="center" id="video_30148"&gt;&lt;br /&gt;(3351 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30148" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30148.ashx" length="11962" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/11/081117a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/11/081117b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Communications/default.aspx">Communications</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category></item><item><title>RFID "Sniffer" Architecture</title><link>http://engineeringtv.com/blogs/etv/archive/2008/11/13/rfid-quot-sniffer-quot-architecture.aspx</link><pubDate>Thu, 13 Nov 2008 15:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30145</guid><dc:creator>Terry Knight</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30145</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/11/13/rfid-quot-sniffer-quot-architecture.aspx#comments</comments><description>As RFID adoption continues to grow, engineers are faced with an increasing need to validate tags both for interoperability with products from other vendors and for conformance with the specified protocol.  The &amp;quot;sniffer&amp;quot; RFID tag test system uses a vector signal analyzer to “sniff” the air interface between an interrogator and a tag.  This system uses a reference “gold” reader or RFID simulator to initiate an interrogation round with the tag.  Meanwhile, the RF VSA (vector signal analyzer) is used to record and analyze both tag and reader transmissions over an RF air interface.
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&lt;p&gt;&lt;p align="center" id="video_30145"&gt;&lt;br /&gt;(2119 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30145" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30145.ashx" length="12952" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/11/081113a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/11/081113b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/RF/default.aspx">RF</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category></item><item><title>NexJen RFID Test System</title><link>http://engineeringtv.com/blogs/etv/archive/2008/11/12/nexjen-rfid-test-system.aspx</link><pubDate>Wed, 12 Nov 2008 15:00:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30144</guid><dc:creator>Terry Knight</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30144</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/11/12/nexjen-rfid-test-system.aspx#comments</comments><description>The NEXJEN-VISN-100 RFID Test System is the result of a partnership between VI Services Network and Nexjen Systems.  The system is a conformance test and measurement solution for RFID devices, and is the first instrument in the world with an integrated RFID protocol stack and real-time communication capability.  The tester is based on National Instruments vector RF modules, including the 2.7GHz Upconverter, the 2.7 GHz Downconverter, the 3 GHz RF Preamplifier and the FPGA based RF Transceiver.
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&lt;p&gt;&lt;p align="center" id="video_30144"&gt;&lt;br /&gt;(1093 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30144" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30144.ashx" length="10090" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/11/081112a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/11/081112b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/RF/default.aspx">RF</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category></item><item><title>Challenges and Trends in Condition Monitoring</title><link>http://engineeringtv.com/blogs/etv/archive/2008/11/04/challenges-and-trends-in-condition-monitoring.aspx</link><pubDate>Tue, 04 Nov 2008 16:22:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30124</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30124</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/11/04/challenges-and-trends-in-condition-monitoring.aspx#comments</comments><description>Signal.X specializes in engineering services and custom application development in diverse fields related to machinery noise and vibration.  For machine diagnostics and online surveillance, National Instruments condition monitoring systems have been successfully implemented on a variety of turbines, compressors, generators, and other devices.  Machine condition monitoring can help your organization stop unscheduled outages, optimize machine performance, and reduce repair time and maintenance costs.  Mike Albright, General Manager at Signal.X Technologies, and Stuart Gillen, Sound &amp;amp; Vibration Group Manager from National Instruments, discuss some of the challenges they&amp;#39;ve encountered and trends they&amp;#39;ve observed in the world of condition monitoring.
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&lt;p align="center" id="video_30124"&gt;&lt;br /&gt;(1037 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30124" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30124.ashx" length="9981" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/11/081104a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/11/081104b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Mechanical/default.aspx">Mechanical</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category></item><item><title>Condition Monitoring and Mapping</title><link>http://engineeringtv.com/blogs/etv/archive/2008/11/03/condition-monitoring-and-mapping.aspx</link><pubDate>Mon, 03 Nov 2008 15:55:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30119</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30119</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/11/03/condition-monitoring-and-mapping.aspx#comments</comments><description>Mike Albright, General Manager at Signal.X Technologies and Stuart Gillen, Sound &amp;amp; Vibration Group Manager from National Instruments, discuss some applications for condition monitoring.  Condition monitoring is the process of monitoring a parameter of condition in machinery, such that a significant change is indicative of a developing failure.  The use of conditional monitoring allows maintenance to be scheduled, or other actions to be taken to avoid the consequences of failure, before the failure occurs.
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&lt;p&gt;&lt;p align="center" id="video_30119"&gt;&lt;br /&gt;(863 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30119" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30119.ashx" length="11684" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/11/081103a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/11/081103b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Mechanical/default.aspx">Mechanical</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category></item><item><title>Testing the Wii with PXI - Part 2</title><link>http://engineeringtv.com/blogs/etv/archive/2008/10/23/testing-the-wii-with-pxi-part-2.aspx</link><pubDate>Thu, 23 Oct 2008 15:33:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30107</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30107</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/10/23/testing-the-wii-with-pxi-part-2.aspx#comments</comments><description>Barron Stone and Chetan Kapoor have conducted a teardown of the Nintendo Wii to test various components using National Instruments LabVIEW and PXI based modular instruments.  In Part 2 of this Engineering TV video, Barron discusses using the PXI-5114, a high-speed digitizer, to test the Wii&amp;#39;s video signals.  Using NI’s patented T-Clock synchronization technology, these digitizers can be synchronized to create systems of up to 34 phase-synchronous 1 GS/s channels, or they can be integrated with other NI hardware to build a complete, automated mixed-signal test system.  Chetan Kapoor reveals additional capabilities of the PXI modular system when working with the Nintendo Wii Remote.
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&lt;p align="center" id="video_30107"&gt;&lt;br /&gt;(1552 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30107" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30107.ashx" length="13312" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/10/081023a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/10/081023b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Gaming/default.aspx">Gaming</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Audio-Visual/default.aspx">Audio-Visual</category></item><item><title>Testing the Wii with PXI - Part 1</title><link>http://engineeringtv.com/blogs/etv/archive/2008/10/22/testing-the-wii-with-pxi-part-1.aspx</link><pubDate>Wed, 22 Oct 2008 16:48:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30104</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30104</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/10/22/testing-the-wii-with-pxi-part-1.aspx#comments</comments><description>At NIWeek 2008, Barron Stone and Chetan Kapoor chose the Nintendo Wii to demonstrate using National Instruments technology to comprehensively test complex electronic systems.  Nintendo Wii is a next generation gaming console that competes with the likes of Microsoft Xbox 360 and Sony Playstation 3.  In this demo, a Nintendo Wii was torn down to explore its inner operations and understand how PXI based systems can be used to comprehensively test its critical components.  Various components such as the EEPROM on the Wii Remote, and Video and Audio output from the Wii console were tested using LabVIEW graphical programming language, and PXI based modular instruments.
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&lt;p align="center" id="video_30104"&gt;&lt;br /&gt;(1434 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30104" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30104.ashx" length="11421" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/10/081022a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/10/081022b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Gaming/default.aspx">Gaming</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Instrumentation/default.aspx">Instrumentation</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Audio-Visual/default.aspx">Audio-Visual</category></item><item><title>Optimizing Wireless Data Acquisition</title><link>http://engineeringtv.com/blogs/etv/archive/2008/10/20/optimizing-wireless-data-acquisition.aspx</link><pubDate>Mon, 20 Oct 2008 15:20:00 GMT</pubDate><guid isPermaLink="false">47e16688-3829-4dd3-b275-52b24bfef241:30102</guid><dc:creator>CurtisEllzey</dc:creator><slash:comments>0</slash:comments><wfw:commentRss xmlns:wfw="http://wellformedweb.org/CommentAPI/">http://engineeringtv.com/blogs/etv/rsscomments.aspx?PostID=30102</wfw:commentRss><comments>http://engineeringtv.com/blogs/etv/archive/2008/10/20/optimizing-wireless-data-acquisition.aspx#comments</comments><description>Charlie Stiernberg discusses optimizing wireless DAQ networks using National Instruments LabVIEW.  LabVIEW provides a wide range of connectivity options through open protocols, instrument drivers, and a development environment that you can use to build your own connectivity.  To simplify connectivity for wireless sensor networks (WSN&amp;#39;s), engineers at National Instruments have developed LabVIEW drivers for wireless sensor networks from Accsense, Accutech, Banner Engineering, and Crossbow Technology gateways.  An open software platform with support for multiple standards, LabVIEW helps you easily combine different technologies and future-proof your investment.
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&lt;p&gt;&lt;p align="center" id="video_30102"&gt;&lt;br /&gt;(1048 Views, 0 Comments)&lt;/p&gt;&lt;img src="http://engineeringtv.com/aggbug.aspx?PostID=30102" width="1" height="1"&gt;</description><enclosure url="http://engineeringtv.com/blogs/etv/attachment/30102.ashx" length="11069" type="image/gif" /><enclosure url="etv/common/intro&#xD;&#xA;etv/2008/10/081020a&#xD;&#xA;etv/common/teaser&#xD;&#xA;adv&#xD;&#xA;etv/2008/10/081020b&#xD;&#xA;adv&#xD;&#xA;etv/common/outro" length="0" type="application/octet-stream" /><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Software/default.aspx">Software</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Test/default.aspx">Test</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/RF/default.aspx">RF</category><category domain="http://engineeringtv.com/blogs/etv/archive/tags/Embedded/default.aspx">Embedded</category></item></channel></rss>